KLA Corporation Wafer Processing System - High-Speed, Accurate, and Reliable Specification: * Wafer processing technology: Deep Reactive Ion Etch (DRIE) * Processing speed: Up to 100 wafers per hour * Accuracy: +/- 10 nanometers * Reliability: 99.9% uptime guarantee The KLA Corporation Wafer Processing System is a cutting-edge solution for semiconductor manufacturers. With its high-speed processing capabilities and unparalleled accuracy, this system ensures consistent and reliable results. With a 99.9% uptime guarantee, you can trust that your wafers are in good hands. Note: The specification section highlights the key features of the product, including the wafer processing technology, processing speed, accuracy, and reliability. The description provides additional information on the benefits and guarantees of the product.