Wafer Processing | Ultratech wafer processing services
- Supplier Michael Tierney
- Country Canada
- Supply Ability 70000 Piece
- Minimum Order 90 Piece
Product Description
Specification: * Wafer diameter: 200mm, 300mm * Thickness: 200um, 300um * Material: Silicon, Germanium, Gallium Arsenide * Processing: Deep Reactive Ion Etching (DRIE), Photolithography, Chemical Vapor Deposition (CVD) Looking for high-quality and reliable ultratech wafer processing services? Our state-of-the-art facility offers a range of services including DRIE, photolithography, and CVD for silicon, germanium, and gallium arsenide wafers. Meet your production needs with our fast turnaround times and competitive pricing.
